- Coordinates and supervises all Die attach & Wire Bond project activities and operations in assembly process/ integration phase of R&D projects.
- Lead a team of Process Development Engineers and Support Technicians to execute & monitor Die attach & Wire Bond activities from process development to product realization and subsequently leading to successful mass volume production.
- Plans and administers work, ensuring maximum productivity and cost efficiency from development to product realization.
What we look for
- Min Bachelor's Degree in Electrical / Electronics / Mechanical Engineering, Chemical or equivalent.
- Preferred with working experience in HVM environment for IC or Led manufacturing.
- 3-5 years in HVM experience in IC/LED/Semiconductor R&D environment especially in Die Attach & Wire Bond process scope.
- Technical knowledge in semiconductor or LED backend assembly processes.
- 6 Sigma Methodology, Green/Black Belt is an advantage.
- MS Office Competent
Please contact Nurul Ain Rosli for further information via NURUL-AIN.ROSLI@AMS-OSRAM.COM or +6043053200.