- Develop or optimize Die Bond and Wire Bond processes for new product development project to meet project cost, quality and timeline targets.
- Participate and support FOL processes tehcnology roadmap and building block activities.
- Equipment selection which meet project cost, quality and timeline target.
- Share and transfer technical know how within R&D and to Manufacturing team.
- Provide technical guidance or job coaching to junior supporting staff.
- Participate in engineering sample, pre-series and ramp-up build to fulfill custoemr order.
What we look for
- Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.
- > 5 years of experience in semiconductor field.
- > 5 years of experience in Die Bond and Wire Bond processes.
- Process egnineering knowledge in semiconductors or LED manufacturing processes.
- Knowledge in process development step and statistic.
- B. Minitab knowledge will be advantage.
- Six Sigma Green or Black Belt will be advantage.
Please contact Nurul Ain Rosli for further information via NURUL-AIN.ROSLI@AMS-OSRAM.COM or +6043053200.