- Develop, validate, and apply finite element analysis for LED chips & packages development project.
- Provide interdisciplinary support to the Technology & R&D team from concept to product.
- Support the development team in identifying and preventing early-stage design issues and risks.
- Diagnose customer issues using physics-based explanations and recommend appropriate solutions.
- Recommend design and process improvements to enhance product performance.
- Drive development of leading-edge simulation approaches and advanced material modelling to improve accuracy and efficiency.
- Identify and leverage resources and expertise from research institutions/universities for relevant studies/projects.
- Provide technical guidance and coaching to junior engineers/peers through knowledge sharing.
What we look for
- Ph.D/Master’s/Bachelor’s degree in Mechanical Engineering, Computational Mechanics, Materials Science, Physics, or Mathematics, with relevant industrial experience.
- Strong understanding of applied mechanics, with emphasis on analytical, computational, and measurement methods.
- Hands-on experience with simulation tools (ANSYS/COMSOL/others FEA or CFD tools, etc.) and CAD tools.
- Experience in optoelectronic material characterization methodologies, analysis, and new concepts in model creation.
- Strong analytical thinking with excellent communication skills.
- Understanding of packaging technologies, assembly processes, opto-semiconductor packaging materials, reliability test requirements, and failure analysis techniques.
- Hands-on computer programming skills (Matlab, C++, etc.) will be an added advantage.
- Experience in process modeling will be an added advantage.
Please contact Nurul Ain Rosli for further information via NURUL-AIN.ROSLI@AMS-OSRAM.COM or +60 (4) 3053200.