- Develop, validate and apply predictive Multiphysics simulation chip & package models.
- Interdisciplinary support for R&D team from idea to product.
- To assist R&D team in Identifying & preventing design issues or risk in the early stage of development.
- Act as a problem solver by finding physics-based explanations to customers’ problems and suggesting appropriate solutions.
- Recommend and suggest design / process improvements to enhance the product performance.
- Drive continuous development of leading-edge simulation approaches & advanced material modelling to enhance simulation accuracy and efficiency.
- Ability to identify and leverage on the resources and expertise of research institutions/universities for such studies / projects if appropriate.
- Provide technical guidance & coaching to junior engineers/R&D peers through knowledge sharing.
What we look for
- Ph.D/Master’s/Bachelor’s Degree in Physics, Mechanical Engineering, Computational Mechanics, or Materials with relevant industrial experience.
- Profound understanding of optoelectronic and photonic devices with emphasis on both analytical & computational and measuring method.
- Hands-on experience in simulation tools (Comsol/ ANSYS, etc.) & CAD tools.
- Experience in optoelectronic material characterization methodology, analysis & new concept in model creation.
- Strong analytical thinking with excellent communication skills.
- Understanding in packaging technologies, assembly processes, opto-semiconductor packaging materials.
- Hands-on in computer programming skill (Matlab, C++, etc.).
- Deep understanding in packaging technologies, assembly processes, semiconductor packaging materials, reliability standards, FA techniques will be an added advantage.
Please contact Nurul Ain Rosli for further information via NURUL-AIN.ROSLI@AMS-OSRAM.COM or +6043053200.