Job Description
Process Development & Integration Staff Engineer
Bayan Lepas, Malaysia

Sense the power of light

ams OSRAM is a global leader in innovative light and sensor solutions. “Sense the power of light” – our success is based on our deep understanding of the potential of light. By adding intelligence to light, we enable our customers to drive transformative applications. Our around 20,000 employees worldwide focus on innovation alongside the societal megatrends of digitalization, smart living, energy efficiency, and sustainability. Whatever your role is, you are a part of a talented team that enjoys exploring and designing new technologies.

Your new responsibilities

  • To initiate package concepts, own and drive advanced package selection, new product package structure and configuration optimization to meet product profile requirements as well as customer requirements & targeted product cost.
  • Work with cross functional team and lead package integration efforts.
  • Drive industry with advanced Package solutions, new material development, manufactuability, yield improvement and product cost reduction.
  • To ensure self development to continually upgrading overall performance  as well as maintaining organizational knowledge through design guideline, simulation, design rules, supplier capability, knowledge management system & actively participating in internal and external knowledge sharing (Technical symposium, trade shows, etc).
  • Lead problem solving team to address technical issue arises during package development.
  • Lead product cost reduction project.
     


What we look for


  • Bachelor or higher Technical Degree (e.g Electrical, Mechanical, Chemical, Material, Physics, etc.)
  • min 5 years in packaging (Package architecture / Package integration Innovation)
  • Hands-on working knowledge and experience with AutoCAD or a related 3D modeling application(s)
  • Has working knowledge in materials characterization and analysis
  • General understanding of packaging technologies, knowledge of wafer level packaging, assembly processes, packaging materials, reliability standards, FA techniques, simulation (e.g. thermo-mechanical & optical)  etc.
  • Prior experience with semiconductor assembly operations.
  • Exposure to automotive packaging is a plus.
  • Good engineering problem solving skills (DMAC, 8-D etc) with strong engineering physics and fundamentals.
  • Good communication skills that can enable the candidate to work well with internal cross functional teams and overseas suppliers
  • Good program management skill.
  • Knowledge in Semiconductor Technology, DOE and Statistic, Equipment, Cost and Budgeting, Quality Tools, Process Knowledge, materials characterization and analysis, problem solving skills.


Please contact Nurul Ain Rosli for further information via NURUL-AIN.ROSLI@AMS-OSRAM.COM or +6043053200.

ams OSRAM is an Equal Employment Opportunity Employer. Diversity, equity and inclusion is strongly established in our corporate culture and we firmly believe it makes us more successful as a company. All qualified applications will receive consideration for employment regardless of ethnic, national or social origin, gender, gender identity, sexual orientation, color, religion, age, physical and mental abilities.
Information at a Glance
Job ID:  19724
Posting Start Date:  2/12/25
Job Family:  Research & Development
Career Level:  Professional (> 3 years)
Company:  OSRAM OS Penang
Schedules:  Full Time
Work Model:  On-Site
Job Shift:  Flex time
Employment Type:  Regular
Department:  OS MY Product Integration Efficacy & Module

Application deadline: As long as the job is listed on our career page, we are looking for suitable candidates. We look forward to receiving your application.