• Develop, qualify, and optimize wafer/die sawing processes to achieve targeted product quality, reliability, and manufacturing performance.
• Conduct process studies and Design of Experiments (DOE) to improve process capability, yield, and overall efficiency.
• Define and maintain robust process parameters and operating windows for stable production.
• Lead process qualification and industrialization activities, supporting the transition from development to high-volume manufacturing.
• Drive continuous improvements in yield, cycle time, equipment utilization, and manufacturing cost.
• Analyze process, yield, and equipment data to identify root causes of technical and quality issues.
• Apply structured problem-solving methodologies such as DMAIC, 8D, FMEA, and Fishbone Analysis to resolve manufacturing challenges.
• Implement corrective and preventive actions to prevent recurring process excursions and defects.
• Utilize statistical tools and methodologies, including SPC, Cp/Cpk analysis, control charts, and trend analysis, to monitor and improve process performance.
• Plan and execute statistically sound experiments to optimize process capability and manufacturing robustness.
• Prepare technical reports, data analysis, and recommendations to support engineering decisions.
• Lead Lean Six Sigma and operational excellence initiatives to improve productivity, reduce waste, and lower manufacturing costs.Collaborate closely with Operations, Equipment Engineering, Quality Engineering, Product Engineering, Reliability Engineering, and R&D teams to resolve technical issues and support new product introductions.
• Support customer audits, technology transfers, benchmarking activities, and cross-site knowledge sharing to promote best practices across the organization.

What we look for

• Bachelor’s Degree in Engineering, Materials Science, Physics, or a related field.
• Minimum 2 years of semiconductor process engineering experience.
• Hands-on experience in semiconductor or LED manufacturing processes.
• Knowledge of FOL processes such as sawing, die attach, and wire bond is preferred.
• Experience in Process Development or New Product Introduction (NPI) is an advantage.
• Strong analytical, troubleshooting, and problem-solving skills.
• Familiarity with statistical analysis, SPC, DOE, and Six Sigma methodologies.
• Proficient in Microsoft Excel, Word, PowerPoint, and Minitab.
• Good communication and teamwork skills in a cross-functional manufacturing environment.
• Fresh Graduates are encourage to apply.

Please contact Nurul Ain Rosli for further information via NURUL-AIN.ROSLI@AMS-OSRAM.COM or +60 (4) 3053200.