• Support New Product Introductions by delivering assigned Process and Equipment solutions meeting or exceeding Quality and timeline targets.
• Deliver assigned Process and Equipment solutions meeting or exceeding Quality and timeline targets.
• To ensure equipment second source and cost savings targets be met through new supplier or new process introduction.
• Identify new possibilities and evaluate process technologies to improve yield and quality.
• To contribute to effective resolution of chronic issues through innovative or out-of-box solutions.
• To provide active support and technical inputs in Team based problem solving efforts.(eg Focus Team).
• To ensure self development to continually upgrading overall performance by maintaining organizational knowledge through design guideline, design rules, supplier capability, knowledge management system & actively participating in internal and external knowledge sharing (Technical symposium, trade shows, etc).

What we look for

• Bachelor's Degree in Engineering (Mechanical/ Mechatronic/ Electromechanical), Engineering (Material Science), Physics or equivalent.
• 5 - 10 years in semiconductor Casing/Optical Element Attach/Die Attach process engineering field
• Experience in Process development or New Product Introduction would be an advantage.
• Hands-on and process development experience in FOL related processes e.g. sawing, die attach and wire bond process in semiconductors or LED manufacturing processes.
• Strong analytical skill, systematic problem solving approach skill, statistical knowledge with knowledge of Six Sigma is preferred.
• An in-depth knowledge of Microsoft Excel, Word, PowerPoint and MiniTab is required.

Please contact Nurul Ain Rosli for further information via NURUL-AIN.ROSLI@AMS-OSRAM.COM or +6043053200.