• Project lead for product development projects, which will be manufacture at subcontractor sites locally and overseas. Lead cross function teams in planning, reviewing and execution to meet project targets, time, quality, and cost.
• Leading product definition activities, working with Product Line, application, marketing, quality, subcon partners and customers.
• Knowledgeable and understand state of LED packaging technology & roadmaps and incorporate into product development projects to deliver a timely cost effective solutions.
• Knowledgeable in schematics and physical PCB layouts, ensuring performance, manufacturability, and industry standards for Level 2 LED package development.
• Lead, drive & manage LED packaging subcontractors to enable state of the art product solutions for ams-OS.
• Actively seeking key experts’ inputs (internal experts & external experts@subcon) in process and material to ensure process and material capabilities are fully considered in project scope.
• Recognize & escalate serious and critical situations as necessary with situation analysis, available options, consequences, and recommendations.
• To consistently update the progress and status of project within various reporting levels.
• Responding and taking necessary actions to address urgent customer issues.

What we look for

• Bachelor Degree in Science, Technology, Engineering or equivalent.
• At least 3-5 years of working experience in the related field is required for this position.
• 3-5 years of Project Management experience in managing cross functional team.
• Preferably with LED or Semiconductor packaging knowledge or package/product development knowledge.
• Surface Mount Technology process and PCB design know-how is an added advantage.
• Control span of multiple CFT across internal & external team.
• Possess advance Project Management skills will be a strong advantage.
• Strong analytical skill, systematic problem solving approach skill (6sigma), statistical knowledge, very careful and detailed-oriented personality.
• Requires basic Product Costing knowledge. Able to understand various factor that affecting product cost.
• Good report-writing and data analysis skills are required. An in-depth knowledge of Microsoft Excel, Word, Project & Powerpoint is required.
• Ability to operate Solidworks or equivalent pcb design software will be an added advantage.
• Must have good interpersonal skills and very good communication skills to liaise between different departments/groups.
• Ability of long-miles travelling (out-station) to sub-con over long period of time for supervision/workshop/meeting.

Please contact Nurul Ain Rosli for further information via NURUL-AIN.ROSLI@AMS-OSRAM.COM or +6043053200.