- Design, optimize, and monitor Sawing & tape mounting process equipment such as Disco 6340, 6341, 6750, Hanmi & Rokko handlers.
- Oversee technical projects, ensuring product reliability, improving machine performance, and collaborating closely with cross-functional teams including manufacturing, quality, and R&D.
- Troubleshoot and resolve Sawing & mounting machine issues and defects.
- Ensure quality control of products throughout sawing process.
- Lead continuous cost down/ productivity / quality improvement initiative.Maintain compliance with environmental and safety regulations.
- Coordinate & manage a group of technician.
What we look for
- Bachelor's Degree in Science and Engineering/Physics/Electronic Engineering/ Mechanical or Mechatronic Engineering.
- Min 5 years involved in the LED Manufacturing / Semiconductors Field
- Min 5 years working experience in LED/ IC assembly packaging process especially on Sawing/singulation Process or Equipment engineering personnel.
- Experience & ability to lead a group of engineers & technician. Knowledge on Semiconductors & LED Characteristic.
- In-depth knowledge of various sawing methods (e.g., band saw, circular saw, wire saw, etc.). Familiarity with blade/material selection based on application (e.g., metal, semiconductor wafers, composites).
- Understanding of tolerances, surface finish, and dimensional control & Expertise in vibration control, thermal management, and wear mechanisms in cutting tools.
- Knowledge on LED Manufacturing Process. Knowledge on Preventive / Predictive Maintenance process.
Please contact Shin Yih Cheah for further information via SHIN-YIH.CHEAH@AMS-OSRAM.COM