- Proactive involvement in quality issues related to New product Development, involving interaction with Product Development, Backend Technology, Manufacturing; Customer Quality Management Locally and Globally (including Rbg, Wux, Subcon).
- Quality and Reliability Governance wrt New Products, covering :
a) Upstream activities including Technical Risk Assessment, Requirement profile, Reliability Test requirement generation, Design FMEA , Material Robustness, Design Robustness, Process Robustness,
b) Downstream activiites including Process FMEA. Customer Complaint, RMA, PPCM, Risk assessment, Special Clearance, Shipment Halt and Release.
- Run internal line audit for the new process and line setup, in assessing line readiness for release to production.
- React to failure from debugging run with cooperation and support from the development group.
- Make sound decision on the required evaluation, pre production release reliability test run of the new product for particular risk assessment.
- Analyze correctly the analysis made by the FA or reliability group based on the result given.
- Setup Outgoing QA Buyoff and drive team to resolve OQA rejects in reducing escapee to customer.
- Perform New product Reliability Qualification, Evaluation, Robustness (including Material, Design, Process Integration study and Robustness).
Who we are looking for
- Bachelor of Engineering, Electrical Electronics, Science.
- Min 3 years of experience in:
- Quality Engineering; Semiconductor Reliability and Packaging Quality.
- Experience handling product inhouse and also with Subcons.
- Core Quality member of new project run
- Semiconductor product and processes for Visible LED, IR LED, Detectors, IC and Laser.
- Reliability testings, Failure analysis methods, Quality Engineering topics and Customer quality support for new product introduction.
- Basic skill in Microsoft Office.
- English and Bahasa Malaysia (mandatory), Mandarin (optional)
Please contact Ronald Heon Lon Yip for further information via RONALD.YIP@AMS-OSRAM.COM or .