1. Equipment Maintenance & Troubleshooting:
• Perform preventive and corrective maintenance on wire bonders (e.g., Shinkawa, ASM, etc.).
• Diagnose and resolve equipment-related issues to minimize downtime.
• Lead root cause analysis (RCA) for recurring failures and implement corrective actions.
2. Process Optimization:
• Optimize wire bonding parameters (e.g., force, ultrasonic power, temperature) to improve yield and throughput.
• Conduct DOE (Design of Experiments) to enhance process stability and performance.
• Work with process engineers to qualify new materials (wire types, capillaries) and bond pad designs.
3. New Equipment & Technology Development:
• Evaluate and qualify new wire bonding equipment and technologies.
• Lead installation, commissioning, and validation of new bonders.
• Develop and document Standard Operating Procedures (SOPs) and best-known methods (BKMs).
4. Yield & Quality Improvement:
• Analyze bond strength, pull test data, and shear test results to ensure quality standards.
• Collaborate with quality and reliability teams to address bond-related defects.
• Implement SPC (Statistical Process Control) to monitor process stability.
5. Cross-functional Collaboration:
• Work with production, process integration, and R&D teams to meet product requirements.
• Support failure analysis (FA) for wire bond-related issues in packaged devices.
• Train technicians and junior engineers on equipment operation and maintenance.
6. Continuous Improvement & Cost Reduction:
• Identify opportunities to improve equipment uptime, cycle time, and consumable lifespan.
• Drive cost-saving initiatives through process optimization and vendor collaboration.

What we look for

• Bachelor’s/Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
• 5+ years of hands-on experience with wire bonding equipment in semiconductor assembly/packaging.
• Proficiency in wire bonder platforms (Shinkawa, ASM,K&S  etc.) and bonding technologies (ball bonding, wedge bonding).
• Strong understanding of metallurgy, intermetallic formation, and wire bond reliability.
• Familiarity with SEMI standards, cleanroom protocols, and ESD controls.
• Strong problem-solving and analytical skills (8D, FMEA, Fishbone).
• Excellent communication and teamwork abilities.
• Project management experience (Lean Six Sigma certification is a plus).
• Experience with Au wire bonding, Ag sintering.
• Knowledge of automation (SECS/GEM, HSMS) and data analysis tools (JMP, Python, SQL).
• Cleanroom/manufacturing setting with occasional overtime to support production needs.

Please contact Nurul Ain Rosli for further information via NURUL-AIN.ROSLI@AMS-OSRAM.COM or +6043053200.