• Develop and release work instructions based on engineering build requests, define critical process parameters, equipment setup, and material flow for hermetic assembly, and support engineering builds, qualification runs, and new product introductions (NPI)
• Take full ownership of wafer saw/dicing, die attach/die bond, wire/lead bond, and hermetic sealing processes, ensuring stability, repeatability, and compliance with quality and reliability standards
• Monitor daily production performance, conduct root cause analysis on process deviations, implement corrective and preventive actions, and provide hands-on support to resolve line issues quickly
• Drive continuous improvement initiatives to enhance yield, reduce costs, and optimize capacity, leading Kaizen, Lean, or Six Sigma projects, and implementing process optimization opportunities
• Maintain updated process flows, control plans, and work instructions, train and certify operators and technicians on process standards, and support overseas training or technology transfer during line ramp-up
• Collaborate with project teams, QA, and operations to ensure ceramic assembly line readiness, supporting line setup, qualification, and ramp-up toward target production volumes and timelines

Who we are looking for

• Bachelor’s degree in engineering (Electronics, Mechanical, Materials, or equivalent)
• Minimum 3–5 years’ experience in semiconductor or electronics assembly      
• Strong experience in wafer saw/dicing, die attach/bonding (eutectic), wire/lead bonding, and hermetic sealing processes.

Please contact Soi Kim Kee for further information via suki.kee@ams-osram.com or +65 () 62402395.