• Responsible in the definition and development of a new product test solution taking into account device datasheet requirements, development cost, lead time and test coverage. This test solution will include mass volume wafer level test and Package Final test
• Close cooperation with the whole product development team (NPI, Project Management, Design, Apps, Etc.) to ensure testability of IC products in a very early product design phase. This may include but not limited to influencing the product design engineer to consider design for test (DFT) considerations such as developing the best test concepts and practices for Wafer Level and Package Level tests.
• Acts as the overall lead for all back-end manufacturing development needs. This may include project planning, providing quotes for product test times, HW/SW development, debug and characterization.
• Once a new product is fully qualified and ready for mass volume manufacturing, you will be responsible for the industrialization of all test solutions and handover them to production with a clearly defined stability, repeatability and cost criteria. As part of the process, you will transfer all product know-how and problems that were gained and encountered during the development phase. This may include knowledge transfer activities such as trainings, transfer of technical documentation and solutions, Etc.
• As a key member of the team and as a technical person, you will be involved in setting the vision, setting of strategic goals, resource allocation, delegation of tasks, project management, budgeting, cost estimation and fostering cross functional collaboration to achieve product design wins and shared common goals.

Who we are looking for

• Bachelor's Degree in the areas of Electrical, Electronics, Microelectronics & Measurement Engineering.  Master’s Degree is a plus.
• Minimum 10 years’ test development, SW/HW application, Test Validation work experience in the semiconductor industry with a strong technical background and exposure on IC testing of Power Management, Mixed Signal, Automotive, Industrial, Medical and Sensor IC products. 
• Hands-on experience with deep hardware and software coding and debug knowledge techniques using ATE Machines such LTX-EX and Diamond-X. Familiarity and understanding in the usage of ATE SW tools such as Unison, Envision, Cadence, Pattern tool, Capture tool and C++ coding is a must.
• Deep understanding and experience with high level structured programming languages such as Python and C++. 
• Strong knowledge and understanding of HW circuit design and PCB design rules (Ex. Placement of components, groundings, separation of high and low speed signals, Etc.). Familiarity with the usage of PCB software (Ex. Altium, Etc.) and deep knowledge in HW circuit simulation techniques is a plus. 

Please contact Soi Kim Kee for further information via suki.kee@ams-osram.com or +65 () 62402395.