- Responsible for the immediate repair of Dicing Saw and Tape and Reel handlers including AOI
- Performed equipment conversion based on the SUS provided by Production and Planning. Ensure all completed equipment conversion meet the required specs before release to production above the target.
- Monitor equipment uptime performance, verifies the causes of downtime and ensure handler uptime within or above the target
- Responsible in providing RCA and CAPA on all equipment related issues and downtime
- Supports continuous improvement projects assigned by immediate superior
- Responsible to maintain 5S.
Who we are looking for
- College Level or Any Vocational Technical Course (Electrical, Electronics, Mechanical or Electro-Mechanical)
- With Semiconductor Industry experience is advantage
- Basic Technical Knowledge on Wafer Level Package equipment such as Dicing Saw and Die Taping machine
- With minimum level experience in Semiconductor Industry particularly on Wafer Saw and Tape and Reel equipment
Please contact Soi Kim Kee for further information via suki.kee@ams-osram.com or +65 () 62402395.