- Lead LED packaging structural and thermal design projects, including bracket, encapsulant, pad layout, and heat dissipation path optimization.
- Perform thermal simulation and analysis (e.g., thermal resistance, junction temperature distribution, thermal failure risk) to optimize packaging structure for better heat dissipation.
- Select and validate materials related to structure and thermal management (e.g., substrates, encapsulants, heat sinks) to ensure performance and reliability.Collaborate closely with optical and electrical teams to align structural design and thermal management solutions with overall performance goals.
- Develop and maintain structural design standards and thermal testing specifications to ensure consistency and manufacturability; Support thermal performance validation, reliability testing, and failure analysis to drive continuous improvement and problem resolution.
- Track industry trends in structural and thermal management technologies, promote innovation, and participate in patent applications.
Who we are looking for
- Bachelor’s degree or above in Mechanical Engineering, Materials Engineering, Thermal Engineering, or related fields.
- 5+ years of experience in LED packaging structural design or thermal analysis.
- Proficient in structural and thermal simulation tools.
- Solid knowledge of LED packaging processes and thermal management technologies.Strong project management and cross-functional communication skills.
- Excellent technical communication skills in English and Chinese.
Please contact Ke Li for further information via KE.LI@AMS-OSRAM.COM or +86 510 81908308.