• Responsible for the process of  MOCVD thin film epitaxy growth, assures the operability and operational goals by sustaining and continuous improving the processes . Key KPIs include epitaxy layer performance, cost, yield, CpK, other process related KPI.
• Full responsibility of MOCVD thin film epitaxy growth process, inclusive of define DoE within process window, implement process control. Actively liaise with production, process integration and other functional team to ensure smooth operation and meeting process KPIs. Work closely with equipment team in perform troubleshooting of the epitaxy tool software and hardware part with application of in-situ measurement systems (Deflectometer/Real Temp).
• Drive continuous improvement in productivity including new material qualification, procedure simplication; cross functional support with quality, hardware and etc. Able to work on local or global projects.
• Set-up procedure, buy-off and qualification of new process / equipment together with equipment engineer. Ensure process meeting required quality & standard; maintain/ update process documentation, including work instructions, control plans, material specifications, FMEA, SPACE etc. in accordance to ISO 14001 and IATF standard.
• Lead problem solving or troubleshooting - able to perform data mining with statistical tools eg. Minitab, JMP and able to use various methodology tools alike IS/IS-NOT, WHY-WHY & etc; in root-cause investigation. Able to implement effective preventive & corrective action (poka-yoke, lean concept).
• Understanding of material characterization (PL, XRD, Defect density, 4-point probe, SIMS, SEM/TEM etc.) and the application for epitaxy process output. Makes necessary adjustments to the growth machine recipes to maintain growth parameters within the specified limits.
• Yield Monitoring and Improvement by performing and reporting failure analysis for all the process and equipment 
  related defect using statistical tools,  leading to process characterization and improved process stability, throughput, quality and yields.
• Lead process or product transfer from RnD, phase out to manufacturing to meet product roadmap. Working closely with cross functional team to meet the product performance roadmap.Drive SPC Cp/Cpk for module to meet the fab target and fulfilling IATF requirement, supported by internal engineering team in technical data or facts

What we look for

• PhD, Master, Bachelor Degree in Physics, Chemical Engineering, Material Science or related technical study is preferred.
• Experience in wafer fabrication are handling XRD, Defect density, 4-point probe, SIMS, SEM/TEM. 
• Skilled in MOCVD.
• Able to contribute as a team and key player, to participate or to lead a project.
• Advanced communication skills and ability to interact with all levels of employees.  
• Fluency in English and Bahasa Malaysia.

Please contact Shin Yih Cheah for further information via SHIN-YIH.CHEAH@AMS-OSRAM.COM.