- In charge of the elevant front end wafer fabrication process in Dry Etch / PECVD / ALD fields.
- Full process ownership on quality, yield, damage containment, process capability and stability, cost, CpK and other related KPIs.
- Lead process transfer ramp qualification projects, cooperate with cross-functional teams (Production, Process Integration, Process Development, Industrial Engineering, Production Planning, Quality Management, EHS, Facility Infrastructure & Hook-up, IT/CIM, Procurement, SCM, Project Management, Regensburg counterparts).
- Create and maintain documentation (process/maintenance/operation/tool procurement/safety specification and procedures; FMEA; Control Plans; 8D lesson learnt etc)
- Setup and maintain manufacturing/quality tools (SPC; FDC; SAP PM Scheduling; CIM/EI)
- Provide training to junior engineers, technicians, manufacturing specialists.
- Lead/participate in cross-functional projects (cost/yield/capacity/safety/productivity continuous improvement projects)
Who we are looking for
- Candidate must have at least a Bachelor's Degree in Engineering or Science. Candidate with Master's Degree or PhD will have an added advantage.
- 10 years of front-end semiconductor wafer fab working experience & competency in manufacturing, process engineering, product or process development
- Experienced in leading cross-functional teams (process & equipment engineering, production)
- Ability to work effectively in cross-cultural multi-national working environment & organization.
- Experience with SPC, FDC, 8D problem solving, FMEA, DMAIC, TWI and Digital Manufacturing & Automation.
- Fluent in English and Bahasa Malaysia.
Please contact Muhammad Hafizuddin Mohamed Anuar for further information via Hafizuddin.Anuar@ams-osram.com or +60 (4) 3053141.