- Lead, develop and optimize dicing/ grinding process to ensure robustness of processes with Line of Defense (LOD), Statistical Process Control (SPC) etc control in place.
- To perform risk assessment using FMEA and derive control when needed. Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to quality standard & customer requirements.
- Interaction with Process & Equipment engineer to understand the Process & Equipment capability that influence towards the processes. To work with Product Integration Engineer/FPD/NPI to understand the product integration and process.
- Drive for continuous improvement initiatives to reduce waste, increase tool up time efficiency and improve quality for dicing/ gridining area.
- Collaborate with RBG counterparts to ensure both sites process changes is synchronized and develop future equipment strategy (CEPT/BEST) for dicing / grinding area which included procurement spec for equipment purchase, tool design improvement/PokaYoke, planning & execution within area of responsibility to support manufacturing activities.
- Leads engineering efforts in support of the root cause identification of non-conformances. Will take ownership of implementing corrective and preventive action.
What we look for
- Degree / Master in EE / Mechatronic / Mechanical / Chemical Engineering
- Min. 10 years experience in manufacturing environment
- Min. 5 years experience in dicing/ grinding process engineering
Please contact Shin Yih Cheah for further information via SHIN-YIH.CHEAH@AMS-OSRAM.COM.