- Full equipment ownership on plasma tools (PeCVD and ashing)
- Full equipment ownership on Uptime, OEE, MTTR, MTBF, cost, capability and stability, quality, and other related KPIs.
- Lead equipment start-up/transfer, qualification and ramp related projects.
- Define maintenance procedure and maintenance plan. Define critical spare part required and ensure sufficient stock in place.
- Create and maintain equipment maintenance specification(EMS), checklist, certification & compliance of procedure in assigned functional areas according to safety & quality standard to meet legal & customer requirements
- Provide training to engineers, technicians, manufacturing specialists
- Owner to HIRADC and Safety to equipment and production environment
What we look for
- Bachelor degree or above in Engineering or experience in semiconductor wafer fab (plasma equipment)
- Min 5 years of handling front-end semiconductor wafer fabrication equipment working experience preferably in plasma etching tools
- Skilled in SPC, FDC, 8D problem solving, FMEA, DMAIC, TWI
- Having experience in leading a group of technicians is preferable
- Front-end wafer fabrication process/equipment/material engineering/manufacturing experience
- Good communication skill in English and Bahasa Malaysia.
Please contact Shin Yih Cheah for further information via SHIN-YIH.CHEAH@AMS-OSRAM.COM.