Job Description
Staff Process Engineer ( Dicing/ Grinding/ LLO/ Bonding)
Kulim, Malaysia

Sense the power of light

ams OSRAM is a global leader in innovative light and sensor solutions. “Sense the power of light” – our success is based on our deep understanding of the potential of light. By adding intelligence to light, we enable our customers to drive transformative applications. Our around 20,000 employees worldwide focus on innovation alongside the societal megatrends of digitalization, smart living, energy efficiency, and sustainability. Whatever your role is, you are a part of a talented team that enjoys exploring and designing new technologies.

Your new responsibilities

  • To sustain and optimize dicing/ grinding/ LLO/ Bonding process & equipment for continue improvement, countermeasures issue, ensuring tool maximum productivity, new product qualification & release.
  • Lead, develop and optimize dicing/ grinding / LLO/ Bomding process to ensure robustness of processes with Line of Defense (LOD), Statistical Process Control (SPC) etc control in place.
  • To perform risk assessment using FMEA and derive control when needed. Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to quality standard & customer requirement
  • Interaction with Equipment engineer to understand the Process & Equipment capability that influence towards the processes. To work with Product Integration Engineer/FPD/NPI to understand the product integration and process
  • Drive continuous improvement initiatives to reduce waste, increase tool up time efficiency and improve quality for dicing/ gridining / LLO/ Bonding area.
  • Collaborate with counterparts to ensure both sites process changes is synchronized and develop future equipment strategy (CEPT/BEST)  for dicing / grinding area which included procurement spec for equipment purchase, tool design improvement/PokaYoke, planning & execution within area of responsibility to support manufacturing activities.
  • Leads engineering efforts in support of the root cause identification of non-conformances. Will take ownership of implementing corrective and preventive action.
  • Establishes control measures to ensure conformance to ISO/TS 16949, ISO 45001, ISO 14001, and other standards, while leading customer and certifying body audits.                             


What we look for


  • Degree / Master in Electrical Engineering / Mechatronic / Mechanical / Chemical Engineering
  • Min 10 years experience in manufacturing environment and min 5 years experience in dicing/ grinding / LLO/ Bonding process engineering.
  • Good in presentation and communication
  • Fluency in English and Bahasa Malaysia


Please contact Shin Yih Cheah for further information via SHIN-YIH.CHEAH@AMS-OSRAM.COM.

ams OSRAM is an Equal Employment Opportunity Employer. Diversity, equity and inclusion is strongly established in our corporate culture and we firmly believe it makes us more successful as a company. All qualified applications will receive consideration for employment regardless of ethnic, national or social origin, gender, gender identity, sexual orientation, color, religion, age, physical and mental abilities.
Information at a Glance
Job ID:  22659
Posting Start Date:  1/31/26
Job Family:  Operations & Manufacturing
Career Level:  Experienced Professional (>8 years)
Company:  OSRAM OS Penang
Schedules:  Full Time
Work Model:  On-Site
Job Shift:  Flex time
Employment Type:  Regular
Department:  OS Operations Module 4 Process-Dicing & Grinding

Application deadline: As long as the job is listed on our career page, we are looking for suitable candidates. We look forward to receiving your application.