- Primary owner for plasma etching processes(GaN/SiO2/SiN/ALD film) in ICP chambers .
- Carry out improvement activities related to plasma etching topic (cycle time improvement, CPk improvement, scrap reduction, etag reduction, troughput improvement, cost reduction, new tool start-up and etc).
- Analyze root causes for any process deviations, defects, and yield losses topics related to plasma processes/tools.
- Providing resolution(corrective/preventive action plan) to process issues related to plasma etching.
- Monitor SPC chart and provide improvement plan to ensure Cpk > 1.67
- Maintain and update Standard Operating Procedures (SOPs), process specification, Out of Control Plan(OCAP), FMEA and ECP documents.
- Attend MRB for non-coformance lot disposition and follow up on 8D topic.
What we look for
- Bachelor degree or above in Engineering.
- Min 3 years of experience in wafer fabrication specialized in dry plasma etching. Experience in PeCVD as an added advantage.
- Technical knowledge in the area of electronics and/or semiconductor wafer fabrication.
- Knowledge of problem solving skill, 6Sigma DMAIC approach.
- Skilled in SPC/8D/6Sigma/DOE and Literate in statistic software such as JMP/Minitab/Corenerstone.
- Good communication skill in English and Bahasa Malaysia.
Please contact Shin Yih Cheah for further information via SHIN-YIH.CHEAH@AMS-OSRAM.COM.