Job Description
Wafer Bonding Process Development Engineer / Senior Engineer
Kulim, Malaysia


The ams OSRAM Group is a global leader in innovative light and sensor solutions. As a specialist in Digital Photonics, we combine technological excellence with state-of-the-art global manufacturing capabilities to offer our customers the broadest portfolio of digital emitter and sensor technologies. 
Globally, our teams develop groundbreaking solutions aligned with societal megatrends like intelligent mobility, artificial intelligence, augmented reality, smart health, and robotics. 
At ams OSRAM, employees are part of a highly innovative, international technology environment. Diverse teams, a high degree of ownership, and exciting challenges provide the opportunity to grow, develop, and make a real difference. Because behind our innovations are people who carry something special inside and who bring their unique strengths to work every day. 

Show the world what you are made of.

Your new responsibilities

  • Develop (or transfer from Regensburg) Bonding processes to support the Product (Chip) Development projects. Manage own process projects independently and work on project closure as per timeline planned effectively, well-designed experiments and write clear, concise technical reports documenting the results.
  • Key task is the development of new tool/ processes, material development from tool selection via process otimization to production release of new processes. Strong understanding of the interactions between process and hardwareis required. Cost optimization projects by process improvement, material saving are part of the function as well. Work closely with Process and Production department on improvement activities and drive for further improvements.
  • Deep involvement on new product introduction to ensure smooth transition & ramp up of new products.
  • Key interface between Process RnD Regensburg for new processes and technologies, be the expert for Bonding technologies, have a detailled market overview. Work on Collaboration and Standardization.


What we look for


  • Degree, Master's, or PhD in Physics, Optics, Electrical Engineering, Materials Science, or a related field.
  • Minimum 5 years of experience in the semiconductor industry.
  • Experience in wafer bonding and/or metallization processes is an added advantage.
  • Good understanding of wafer fabrication processes, semiconductor materials, and bonding technologies.
  • Knowledge of relevant analytical and characterization methods.
  • Strong communication, presentation, and teamwork skills.Analytical, creative, and able to work effectively in a fast-paced environment.
  • Able to independently drive process development, new process introduction (NPI), and R&D activities.


Please contact Nurul Ain Rosli for further information via NURUL-AIN.ROSLI@AMS-OSRAM.COM or +60 (4) 3053200.

ams OSRAM is an Equal Employment Opportunity Employer. Diversity, equity and inclusion is strongly established in our corporate culture and we firmly believe it makes us more successful as a company. All qualified applications will receive consideration for employment regardless of ethnic, national or social origin, gender, gender identity, sexual orientation, color, religion, age, physical and mental abilities.
Information at a Glance
Job ID:  24242
Posting Start Date:  9/15/26
Job Family:  Research & Development
Career Level:  Experienced Professional (>8 years)
Company:  OSRAM OS Penang
Schedules:  Full Time
Work Model:  On-Site
Job Shift:  Flex time
Regular/Temporary:  Regular
Department:  OS Kulim Processes 2

Application deadline: As long as the job is listed on our career page, we are looking for suitable candidates. We look forward to receiving your application.