• Literature Review:
o Comparative analysis of colloidal SiO₂, fumed SiO₂, and CeO₂ slurries for STI-CMP including cross-contamination risk mitigation concept for CeO2 slurries
o Investigation of STI-CMP defectivity, with emphasis on microscratch formation and stress-induced defects
• Experimental Work and Analysis:
o Characterization of slurry PSD and zeta potential.
o CMP processing of blank wafers and patterned short-loop wafers to generate defect and inline thickness data
o Drive and organization of ceria slurry demonstration with supplier
o Evaluation of defect and thickness data to identify correlations with slurry properties and CMP settings
Who we are looking for
• Ongoing Master’s studies in Materials Science, Chemistry, Chemical Engineering, Physics, or related fields
• Basic knowledge of CMP processes is an advantage
• Independent, structured, and analytical working style
• Proficiency in English (written and spoken)
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group E (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
Please contact Marlies Nigitz for further information via marlies.nigitz@ams-osram.com or +43 (3136) 50032853.