- Governer and active participation in earlier involvement for simultanoues engineering with R&D team for new product development to design for cost, quality & manufacturability and then hand shake with operation team to achieve flawless ramp expectations for new product release.
- Drive product cost down improvement and manage change project.
- Participate in earlier involvement for start up of new product development by working with R&D team to design for cost, quality & manufacturability.
- Actively participate in risk and manufacturability assessment during new product development phase as the key representative from manufacturing.
Overall responsible for process handshake readiness to enable smooth new product phase into manufacturing. - Lead continuous cost down/ productivity / quality improvement initiative.
- Coordinate proliferation of alternative packaging materials qualification. Coordinate and manage material change risk assessment & qualification.
What we look for
- Bachelor of Science, B.Engineering, B.Sc Physics, B.Sc Electronic Engineering
- Min 5 years involved in the LED Manufacturing / Semiconductors Field
- Min 5 years working experience in LED/ IC assembly packaging process as process/process integration engineer roles.
- Experience & ability to lead a group of engineers & technician.
- Knowledge on Semiconductors & LED Characteristic, New Product Introduction management, LED Manufacturing Process, LED Testing Concept.
- Knowledge on the Minitab, 6 Sigma Tools. Details & Strong Analytical Skills, Systematic 8D problem solving. Planning & Organizing Skills, Project Management Skills.
- Fluency in English, Mandarin and Bahasa Malaysia, added advantage with German language capability.
Please contact Shin Yih Cheah for further information via SHIN-YIH.CHEAH@AMS-OSRAM.COM.