Job Description
Package Development Engineer (d/m/f)
Premstaetten, Austria


The ams OSRAM Group is a global leader in innovative light and sensor solutions. As a specialist in Digital Photonics, we combine technological excellence with state-of-the-art global manufacturing capabilities to offer our customers the broadest portfolio of digital emitter and sensor technologies. 
Globally, our teams develop groundbreaking solutions aligned with societal megatrends like intelligent mobility, artificial intelligence, augmented reality, smart health, and robotics. 
At ams OSRAM, employees are part of a highly innovative, international technology environment. Diverse teams, a high degree of ownership, and exciting challenges provide the opportunity to grow, develop, and make a real difference. Because behind our innovations are people who carry something special inside and who bring their unique strengths to work every day. 

Show the world what you are made of.

Your new responsibilities

  • Develop packages & package technologies for digital photonics (datacom, AR/VR) and optical sensors (ambient light, color, proximity) as part of the engineering team
  • Carry out package design (mechanical & optical design, bill of materials, simulations) and manufacturing at assembly partners
  • Interface with IC design, quality, assembly, test, product management and application teams & represent package development in multi-disciplinary / multi-site product development teams
  • Execute package development to successful completion within given resource constraints (time, budget)
  • Continuously improve package technologies to achieve time, quality and cost targets
  • Select technologies, components, materials & suppliers for new packages together with R&D, Operations & Quality
  • Identify and introduce cost improvements for high volume production
  • Identify and develop new suppliers / technologies 


Who we are looking for


  • Advanced university degree in Physics, Chemistry, Materials Science, Optics, Polymer / Mechanical / Semiconductor Engineering, or related fields
  • 10 year+ experience in advanced semiconductor packaging
  • Technical modelling and drawing in SolidWorks and AutoCAD beneficial
  • Experience in high volume manufacturing for consumer electronics applications is a benefit
  • Experience in collaboration with external manufacturing partners (OSATs)
  • Failure analysis and reliability engineering knowledge, basic knowledge of MEMS and CMOS manufacturing technologies
  • Demonstrated analytical and problem-solving skills, hands-on-mentality, ability to execute developments within tight resource constraints (time, budget)
  • Ability to cope with high workloads in critical project stages and collaborate with diverse teams in multiple geographical locations
  • Strong communication skills, creativity and problem-solving skills
  • Openness to business travel for several weeks per year
  • Fluent in English

 

We offer competitive salaries and additional benefits based on your performance, experience and qualification.
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
We offer a higher compensation depending on your expertise and skills.


Please contact Hana Krsul for further information via Hana.Krsul@ams-osram.com or +43 664 9665611.

ams OSRAM is an Equal Employment Opportunity Employer. Diversity, equity and inclusion is strongly established in our corporate culture and we firmly believe it makes us more successful as a company. All qualified applications will receive consideration for employment regardless of ethnic, national or social origin, gender, gender identity, sexual orientation, color, religion, age, physical and mental abilities.
Information at a Glance
Job ID:  24706
Posting Start Date:  11/13/26
Job Family:  Research & Development
Career Level:  Experienced Professional (>8 years)
Company:  ams-OSRAM AG
Schedules:  Full Time
Work Model:  Hybrid
Job Shift:  Flex time
Regular/Temporary:  Regular
Department:  LSP Package Research & Development
Local Job Grade:  G

Application deadline: As long as the job is listed on our career page, we are looking for suitable candidates. We look forward to receiving your application.