• Architecture Definition & Trade‑offs – Define end‑to‑end system architectures for next‑gen sensor ICs, balancing performance, power, area, scalability, manufacturability, yield, and cost.
• Cross‑domain Partitioning – Lead architecture across analog, digital, firmware, algorithms, and interfaces to ensure optimal implementation strategies.
• Innovation & Technology Scouting – Evaluate new circuit techniques, architectures, and emerging technologies to drive future differentiation.
• Validation & Iteration – Build system‑level models/simulations; analyze silicon characterization data to identify architectural limitations and define improvement plans.
• Strategic Influence – Contribute to technology roadmaps, support key customer engagements, and mentor senior engineering staff.

Who we are looking for

• Required Qualifications

  • Education – Master’s or Ph.D. in EE, Microelectronics, Semiconductor Physics, or related field.
  • Experience – 15+ years in analog/mixed‑signal IC development, including significant hands‑on analog circuit design and substantial architectural leadership.
  • Core Technical Expertise – Deep transistor‑level design proficiency in at least one of:
    Analog Front‑Ends (AFE), Precision Analog, Low‑Noise Signal Chains, Data Converters (ADC/DAC), Power Management, Timing/Clock Generation, Sensor Interface Circuits.
  • System Thinking – Proven ability to perform architecture trade‑offs (noise, power, area, reliability, yield, cost) and to connect circuit implementation with product requirements.
  • Cross‑functional Leadership – Experience driving technical decisions across analog, digital, firmware, algorithm, verification, and product development teams.
  • Soft Skills – Strong analytical, communication, and presentation skills. Fluent English; Mandarin proficiency highly desirable.

  Preferred Qualifications

  • Sensor Experience – Optical sensing (ALS, Proximity, ToF, Spectral, Imaging) or full signal‑chain optimization.
  • Specialized Skills – Ultra‑low‑power, precision analog, ADC/DAC architectures, PLL/timing, power management, or sensor readout circuits.
  • Additional Knowledge – Image/signal processing, sensor fusion, edge ML, or embedded systems.
  • Process & Validation – Multiple technology nodes, behavioral modeling, system simulation, silicon characterization.
  • Impact – Patents, publications, or contributions to long‑term technology strategy.

Please contact Jingjing Hu for further information via TINA.HU@AMS-OSRAM.COM or +86 (510) 81908303.