- As a process expert & responsible for developing new processes/equipment related to Die Attach/Pick & Place.
- Lead in Die Attach/Pick & Place processes for new packages & derivative for new R&D Project
- Assess potential new equipment for Die Attach/Pick & Place process improvement
- Transfer, buy off, set up and qualify new equipment models
- Assist in cost reduction, yield improvement & equipment stability projects
- Liase with stakeholders
What we look for
- Bachelor's Degree in Electrical / Electronics / Mechanical Engineering, Chemical or equivalent.
- At least 3-5 year(s) of working experience in the related field is required for senior position.
- Experience with R&D or New Product Introduction (NPI) in LED/ Semiconductor Assembly environment
- Familiar with transfer & compression Die Attach/Pick & Place design & process qualification
- Highly motivated with strong sense of responsibility & commitment towards work.
- A self-starter and independent.
- 8D, Reporting and Presentation skill is a must
- Experience working in semiconductors industry is an advantage.
- Knowledge of 6 sigma methodology, Process control and qualification is an added advantage.
Please contact Nurul Ain Rosli for further information via NURUL-AIN.ROSLI@AMS-OSRAM.COM or +6043053200.