- Support New Product Introductions by delivering assigned Process and Equipment solutions meeting or exceeding Quality and timeline targets.
- Deliver assigned Process and Equipment solutions meeting or exceeding Quality and timeline targets.
- To ensure equipment second source and cost savings targets be met through new supplier or new process introduction.
- Identify new possibilities and evaluate process technologies to improve yield and quality.
- To contribute to effective resolution of chronic issues through innovative or out-of-box solutions.
- To provide active support and technical inputs in Team based problem solving efforts.(eg Focus Team).
- To ensure self development to continually upgrading overall performance by maintaining organizational knowledge through design guideline, design rules, supplier capability, knowledge management system & actively participating in internal and external knowledge sharing (Technical symposium, trade shows, etc).
What we look for
- Bachelor's Degree in Engineering (Mechanical/ Mechatronic/ Electromechanical), Engineering (Material Science), Physics or equivalent.
- 5 - 10 years in semiconductor Casing/Optical Element Attach/Die Attach process engineering field
- Experience in Process development or New Product Introduction would be an advantage.
- Hands-on and process development experience in FOL related processes e.g. sawing, die attach and wire bond process in semiconductors or LED manufacturing processes.
- Strong analytical skill, systematic problem solving approach skill, statistical knowledge with knowledge of Six Sigma is preferred.
- An in-depth knowledge of Microsoft Excel, Word, PowerPoint and MiniTab is required.
Please contact Nurul Ain Rosli for further information via NURUL-AIN.ROSLI@AMS-OSRAM.COM or +6043053200.