- Full equipment ownership on Plasma Etch tools (Atomic Layer Deposition / Annealling Furnace )
- Full equipment ownership on Uptime, OEE, MTTR, MTBF, cost, capability and stability, quality, and other related KPIs.
- Lead equipment start-up/transfer, qualification and ramp related projects.
- Define maintenance procedure and maintenance plan. Define critical spare part required and ensure sufficient stock in place
- Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to safety & quality standard to meet legal & customer requirements
- Plan maintenance spending budget and ensure the spending are within budget.
- Provide training to technicians, manufacturing specialists
- Owner to HIRADC and Safety to equipment and production environment
- Provide technical leadership, guidance & consultancy on equipment engineering topics with cross-functional teams (Production, Process & Integration, Quality, Industrial Engineering, EHS, IT, Facility, Quality, Fab Management)
Who we are looking for
- Candidate must have at least a Bachelor Degree of Engineering / Science.
- Minimum 5 years of experience in front-end semiconductor wafer fabrication equipment & competency in manufacturing, process engineering, product or process development
- Experience in leading cross-functional teams (process & equipment engineering, production)
- Ability to work effectively in cross-cultural multi-national working environment & organization.
- Experienced with OEE, SPC, FDC, 8D problem solving, FMEA, DMAIC, TWI, Predictive Maintenance, Digital Manufacturing and Automation.
- Fluent in English and Bahasa Malaysia.
Please contact Muhammad Hafizuddin Mohamed Anuar for further information via Hafizuddin.Anuar@ams-osram.com or +60 (4) 3053141.