• Lead cross-functional teams across Front-End (FE) and Back-End (BE) operations to manage excursions, ensuring timely execution, quality performance, and successful reviews.
• Drive planning, setup, and execution of chip integration projects, utilizing expertise in project management and chip-level technical knowledge. Assess and evaluate the impact of Front-End process changes on Back-End product performance, process capability, and long-term reliability.
• Collaborate effectively with FE and BE teams to address chip-related topics, ensuring alignment across design, manufacturing, and quality functions. Investigate and analyze technical issues involving chip design, integration, and production, leading root cause identification and driving corrective actions.
• Take ownership of urgent production issues, responding promptly with appropriate actions to minimize impact on operations and product delivery. Escalate critical issues with thorough situation analysis, outlining available options, risks, and well-justified recommendations for resolution.
• Engage with chip, process and material experts to ensure that capabilities are fully considered and integrated into project scopes and deliverables. Actively participate in structured problem-solving efforts (e.g., Focus Teams), continuously challenging the status quo and driving process improvements. Share global technology knowledge through internal information-sharing platforms and other communication channels. Mentor and coach junior engineers in areas such as problem-solving methodologies, root cause analysis, and failure analysis techniques.
• Maintain and update organizational knowledge, including design guidelines, design rules, and supplier capability matrices, to support ongoing development and performance improvements. Organizational talent, assertiveness as well as the ability of leading global/international teams.

What we look for

• Essential knowledge in the field of semiconductor and device physics, preferably in the development of LED-Chips based on Nitride (AlInGaN) material system.
• Bachelor's Degree in Engineering (Electrical/ Electronic), Engineering (Mechatronic/ Electromechanical), Engineering (Material Science), Physics or equivalent.
• At least 5 years of working experience in the related field is required for this position.
• Good report-writing and data analysis skills.
• Skilled in Microsoft Excel, Word, and Project.
• Good knowledge in Semiconductor / LED / Wafer Fab.

Please contact Shin Yih Cheah for further information via SHIN-YIH.CHEAH@AMS-OSRAM.COM.