- Represents the quality function as the primary interface to internal and external customers during both engineering development and mass production stages
- Leads the resolution of quality issues and drives continuous improvement initiatives within assigned product and process areas
- Drives quality risk assessment and risk mitigation activities throughout the project lifecycle
- Owns prequalification, qualification, robustness validation and safe launch activities
- Acts as the central coordination point for cross-functional quality topics, including Project, Product Design, Process Operations, Internal Quality, Supplier Quality, OSAT, FSO, Failure Analysis, Reliability, and related functions
- Develops failure analysis methodologies for assigned projects to enable rapid root cause identification and effective problem resolution, with support from internal and external laboratories
Who we are looking for
- Bachelor / master’s degree in material sciences, physics, chemistry, electronics or related discipline
- More than 5 years of experience in module packaging, semiconductor backend processes, preferably with hands-on experience in product engineering, product quality, advanced product quality, customer quality management, qualification, failure analysis, and quality issue resolution
- Experience in DFX or DFQ, customer management, reliability, failure analysis, qualification and validation
- Module packaging process, Module testing process, Reliability ,Failure Analysis , Quality tools such as FMEA and 8D
Knowledge of semiconductor device physics, including the operating principles of diodes and transistors, especially LEDs, VCSELs, PDs, and ASICs, is considered a plus - Global and customer interaction experience preferred, with the ability to understand and work effectively across different regional cultures, particularly in Greater China. Occasional business travel may be required depending on project needs
Please contact Soi Kim Kee for further information via suki.kee@ams-osram.com or +65 () 62402395.