- Lead end-to-end product development from concept, feasibility, design validation, qualification to production ramp
- Mentor junior engineers and provide technical leadership within the team
- Develop and execute prototype build/ new materials characterization, including optical, electrical and mechanical assessment with DOE (Design of Experiment) execution.
- Lead and resolve major issues during project and maintain documentations pertaining to engineering root cause findings
- Collaborate and drive cross functional integration across design process, packaging, test, reliability and production teams
- Analyse parametric and yield data to identify trends and drive root cause analysis. Support yield improvement, failure analysis, and reliability testing activities.
- Create and maintain engineering documentations including BOM, defect catalog, control plans and ERS.
- Drive continuous improvements in development methodologies, cost and cycle time
Who we are looking for
- Degree in Electrical, Electronics, Mechanical, Microelectronics, Materials, Optics or Chemical Engineering
- > 5 years in either R&D, packaging technologies, manufacturing environment
- Experience in sensor module packaging and/or optical engineering will be an advantage.
- Ability to lead/mentor junior team members and providing technical expertise in coaching them
Please contact Soi Kim Kee for further information via suki.kee@ams-osram.com or +65 () 62402395.