- Designer of module developed for consumer, industrial and automotive sensing market and conduct design assessment (feasibility, concept, risks) for all new product design product.
- Deep knowledge in Soildworks and Autocad (or any other equivalent) Software and is able to create 3D model, 2D drawing
- Responsible for substrate & flex design, PCBA design and bonding diagram/drawing and other mechanical part designs like molded lids, spacer, metal can, glass design etc. when project necessary
- Ability to list out the CTQ of product and come out FAI/SPC table for part & assembly fabrication and work out technical specifications (TS) for components like substrate, protective liner, product tape and reel by project.
- Leading design review for internal and external customer’s design and provide DFM feedback/suggestion based on design tolerance analysis, vendor’s DFM and in-house process manufacturing capabilities.
- Work closely with cross functional teams such as product engineering, process engineering, IQC, SQE, APQ, and OQC team during product development phase to ensure the build deliveries per project schedule.
Who we are looking for
- Degree/Masters in Mechanical and/or Electrical and/or Mechatronics Engineering
- Proficiency in SolidWorks and AutoCAD is a must.
- Experience in Altium/Cadence for PCB test board routing (electrical background) design would be a plus point with substrate and flex printed circuit (FPC) design knowledge
- Experience in die attach, wirebond process, wirebond encapsulation and packaging in transfer molding or compression molding technology would be plus point.
- Knowledge of COMSOL (or any equivalent software) and ability to conduct FEA and/or CFD simulations is a plus.
Please contact Soi Kim Kee for further information via suki.kee@ams-osram.com or +65 () 62402395.