- Lead LED packaging design projects including COB and high-power modules; Develop and optimize packaging structures for thermal and optical efficiency.
- Select and validate packaging materials such as substrates, adhesives, and encapsulants; Perform thermal, optical, and mechanical simulations to ensure design robustness.
- Collaborate with cross-functional teams for product integration and performance optimization.
- Establish and maintain packaging process standards and documentation; Support reliability testing and failure analysis for continuous improvement.
- Drive innovation in packaging technology and participate in patent applications; Ensure compliance with industrial and environmental regulations.
Who we are looking for
- Bachelor’s degree or above in Materials Science, Electronics, or related field.
- 5+ years experience in LED packaging or semiconductor packaging.
- Proficiency in thermal and optical simulation tools (ANSYS, LightTools).
- Strong knowledge of packaging materials and reliability standards.
- Excellent project management and cross-functional communication skills; Fluent in English and Mandarin for technical communication.
Please contact Ke Li for further information via KE.LI@AMS-OSRAM.COM or +86 510 81908308.