Job Description
Senior Staff Engineer, RD Packaging & Module Engineering
Taipeh, Taiwan

Sense the power of light

ams OSRAM is a global leader in innovative light and sensor solutions. “Sense the power of light” – our success is based on our deep understanding of the potential of light. By adding intelligence to light, we enable our customers to drive transformative applications. Our around 20,000 employees worldwide focus on innovation alongside the societal megatrends of digitalization, smart living, energy efficiency, and sustainability. Whatever your role is, you are a part of a talented team that enjoys exploring and designing new technologies.

Your new responsibilities

  • Process Development & Execution: Lead packaging process development procedures in OSATs, ensuring absolute alignment with product requirements, engineering specifications, and project milestones.
  • Risk Management & Problem Solving: Systematically assess process risks for new product introductions; drive technical benchmarking, failure analysis, and structural root-cause analysis in problem solving process.
  • OSAT Governance & Collaboration: Optimize suppliers’ technical fit and drive higher execution standards for fulfilling engineering requirements and package development roadmap; build long-term frameworks and improvement plans with key partners and explore alternative technology options.
  • Innovation & Cross-Functional Bridge: Contribute breakthrough ideas to the technology roadmap; serve as the primary packaging process technical expert among cross-functional team.
  • Design Rule & Specification Ownership: Manage and strengthen the OSATs’ technical capability database and package design rules for DFM. Oversee engineering design drawings reviews to ensure precise dimensions & tolerances matching with product requirements and process capability.


Who we are looking for


  • Master or above degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or related disciplines.
  • Minimum of 7+ years of solid experience in semiconductor packaging development, with a proven track record of leading complex technical projects.
  • Direct experience in Optical Packaging, Optoelectronics, or Silicon Photonics / Datacom packaging (e.g., high-speed substrates, optical alignment, 2.5D packaging technology) is highly preferred.
  • Subject-matter expertise in backend processes (advanced die attach, precision molding, substrate design, wafer-level packaging).
  • Exceptional skills in advanced failure analysis, statistical tools, and DFM.
  • Strong leadership capability to influence internal stakeholders and externally drive OSAT execution without direct authority.
  • Fluent in English and Mandarin with excellent communication and strategic negotiation skills.


Please contact I-Chen Lou for further information via JENNIFER.LOU@AMS-OSRAM.COM or +886 (2) 25131705.

ams OSRAM is an Equal Employment Opportunity Employer. Diversity, equity and inclusion is strongly established in our corporate culture and we firmly believe it makes us more successful as a company. All qualified applications will receive consideration for employment regardless of ethnic, national or social origin, gender, gender identity, sexual orientation, color, religion, age, physical and mental abilities.
Information at a Glance
Job ID:  24113
Posting Start Date:  8/19/26
Job Family:  Research & Development
Career Level:  Experienced Professional (>8 years)
Company:  ams-OSRAM Taiwan Ltd.
Schedules:  Full Time
Work Model:  On-Site
Job Shift:  Fixed working hours
Regular/Temporary:  Regular
Department:  LSP SubCon Package Development

Application deadline: As long as the job is listed on our career page, we are looking for suitable candidates. We look forward to receiving your application.