-Leading Package design and process integration, leading design &DFMEA review with global team
-Generate and maintain building block knowledge and sharing, Leading for X-projects Building Block development for existing platform
-Ensure synergies (standardize & minimize number of qualified materials) for new product/package platform, taking care on platform fitness and development, leading platform technical risk assessment
-Enable and support Dt-X(design to cost/test/manufacturability)
-Define Building Block design rules, regular alignment between site PDI's
-Triger necessary projects for performance improvement for existing product/package platform (past Q5), Develop derivates/improve platform (test new materials, …)
-Mentoring for new PDIs in WUXI, DMPC facilitator for new package &platform design workshop
-Other tasks assigned by Supervisor
What we look for
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-Bachelor degree or Master in Electrical /Electronic Engineering /semiconductor field -Above 8years working experience in LED process like die bonding, wire bonding, casting/molding, Trim &From and Sawing. -Experienced in package design, process integration, simulation, and project management, Familiar with DFMEA, DFSS, QFD and Six Sigma -CET-4 Minimum, CET-6 preferred. Familiar with Solidworks -Can fluently use different version of office software -Others: Able to work with stress and adapt to fast changes; Good team player. |
Please contact LuPing Zhu for further information via LUPING.ZHU@AMS-OSRAM.COM or +86 (510) 8190 8315.