- Lead package design and process integration; lead design & DFMEA reviews with the global team.
- Generate and maintain building block knowledge and drive sharing across teams; lead Building Block development for X-projects on existing platforms.
- Ensure synergies (standardize & minimize number of qualified materials) for new product/package platforms; oversee platform fitness and development; lead platform technical risk assessments.
- Enable and support Dt-X (Design to Cost / Test / Manufacturability).
- Define Building Block design rules and conduct regular alignment with site PDIs (Process Development Integration).
- Initiate necessary projects for performance improvement on existing product/package platforms (post-Q5); develop derivatives or enhance platforms (e.g., testing new materials).
- Provide consultation and technical support to operations on design-related issues and customer complaints.
- Perform other tasks assigned by the Supervisor.
What we look for
- Education: Bachelor's or Master's degree in Electrical/Electronic/Mechanical Engineering, Semiconductor field, or equivalent.
- Experience: Bachelor’s degree with >8 years, or Master’s degree with >3 years of working experience in LED processes such as die bonding, wire bonding, casting/molding, Trim & Form, and sawing.
- Technical Skills: Experienced in package design, process integration, simulation, and project management. Familiarity with DFMEA, DFSS, QFD, and Six Sigma is preferred.
- Language & Tools: CET-4 minimum; CET-6 preferred. Proficiency in Solidworks.
- Software Skills: Proficient in using different versions of MS Office software.
- Soft Skills: Ability to work under pressure and adapt to rapid changes; a strong team player.
Please contact Jingjing Hu for further information via TINA.HU@AMS-OSRAM.COM or +86 (510) 81908303.