- Leading Package design and process integration, leading design &DFMEA review with global team; Generate and maintain building block knowledge and sharing, Leading for X-projects Building Block development for existing platform
- Ensure synergies (standardize & minimize number of qualified materials) for new product/package platform, taking care on platform fitness and development, leading platform technical risk assessment
- Enable and support Dt-X(design to cost/test/manufacturability); Define Building Block design rules, regular alignment between site PDI's
- Triger necessary projects for performance improvement for existing product/package platform (past Q5), Develop derivates/improve platform (test new materials, …)
- Mentoring for new PDIs in WUXI, DMPC facilitator for new package &platform design workshop
What we look for
- Bachelor degree or Master in Electrical /Electronic Engineering /semiconductor field
- Bachelor >10yrs or Master >7yrs working experience years working experience in LED process like die bonding, wire bonding, casting/molding, Trim &From and Sawing
- Experienced in package design, process integration, simulation, and project management, Familiar with DFMEA, DFSS, QFD and Six Sigma
- CET-4 Minimum, CET-6 preferred. Familiar with Solidworks; Can fluently use different version of office software
- Others: Able to work with stress and adapt to fast changes; Good team player.
Please contact LuPing Zhu for further information via LUPING.ZHU@AMS-OSRAM.COM or +86 (510) 8190 8315.