- Support New Product Introductions by delivering assigned Process and Equipment solutions meeting or exceeding Quality and timeline targets.
- Contribute during project kick-off, product process review, design/drawing review, technical risk assessment, DOE Study, design FMEA, equipment specification preparation, equipment ordering,
- process/equipment setup, process/equipment run, handover documentation to production line, etc.
- Ensure equipment 2nd source and cost savings targets be met through new supplier or new process introduction.
- Contribute to effective resolution of chronic issues through innovative or out-of-box solutions. Leading improvement projects/task for WB related issues
- Able to Setup Wire bond machine independently and able to lead Jr, Engineer.Ensure self-development to continually upgrade overall performance. Represent the Wuxi Site for WB
- BAT core team meeting, coaching the new WB engineers
What we look for
- Bachelor's Degree in Electrical/Electronics/Mechanical Engineering or equivalent.
- >8 years in Semiconductor field and Wire bond process.
- Wire bond equipment (Shinkawa, ASM or K&S) or process experience related. Familiar with LED/Semiconductor assembly process.
- Familiar MFMEA, PFMEA, DOE, JMP or Minitab is required, Familiar with DFMEA, DFSS, QFD and Six Sigma preferred.
- Proficiency in English.
- Able to work with stress and adapt to fast changes.
Please contact LuPing Zhu for further information via LUPING.ZHU@AMS-OSRAM.COM or +86 (510) 8190 8315.