- Full process ownership on quality, yield, damage containment, process capability and stability, cost, CpK and other related KPIs.
- Lead and drive Continuous Improvement Projects (CIP) to enable cost reduction, capacity expansion, yield and performance enhancement to enable the production of Best-In-Class LED chips at competitive cost.
- Lead process transfer, process & tool qualification and ramp related projects. Constantly align with Regensburg counterparts to ensure synchronization between sites.
- Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to safety & quality standard to meet legal & customer requirements.
- Perform risk assessment and derive necessary control to keep process stable. Owner of PFMEA, control plan and working instruction. Lead Customer/Certifying Body Audits.
- Provide direction for process and equipment strategy with procurement spec for equipment purchases.
- Provide training to engineers, technicians, manufacturing specialists.
- Provide technical leadership, guidance & consultancy on process engineering topics with cross-functional teams (Production, Process & Integration, Quality, Industrial Engineering, EHS, IT, Facility, Quality, Fab Management)
What we look for
- Candidate must have at least a Bachelor's Degree in Enginering / Science. Candidate with Master's Degree or PhD will have an added advantage.
- More than 8 years of front-end semiconductor wafer fabrication equipment working experience, competency in manufacturing, process engineering, product or process development.
- Experienced in leading cross-functional teams (process & equipment engineering, production)
- Ability to work effectively in cross-cultural multi-national working environment & organization.
- Skilled in OEE, SPC, FDC, 8D problem solving, FMEA, DMAIC, TWI.
- Fluent in English and Bahasa Malaysia.
Please contact Muhammad Hafizuddin Mohamed Anuar for further information via Hafizuddin.Anuar@ams-osram.com or +60 (4) 3053141.